Vol.15, No.5, 2019, pp.557-582, doi:10.32604/fdmp.2019.04108
Radiation and Chemical Reaction Effects on Nanofluid Flow Over a Stretching Sheet
  • Anupam Bhandari1,*
1 University of Petroleum & Energy Studies (UPES), Department of Mathematics, School of Engineering, Energy Acres Building, Bidholi Dehradun, 248007, Uttarakhand, India.
* Corresponding Author: Anupam Bhandari. Email: pankaj.anupam6@gmail.com.
The present research aims to examine the steady state of the two-dimensional incompressible magnetohydrodynamics (MHD) flow of a micropolar nanofluid over a stretching sheet in the presence of chemical reactions, radiation and viscous dissipation. The effect of particle rotation is taken into account. A conducting fluid passes over a semi-infinite plate with variable temperature while a magnetic field is directed in the transverse direction. Results for velocity, angular momentum, temperature and concentration profiles are obtained for various values of Eckert number, Schmidt number, Prandtl number, thermophosis parameter and Brownian motion parameters. A similarity approach is used to transform the original set of two-dimensional partial differential equations into a set of highly nonlinear-coupled differential equations in dimensionless form. A numerical solution is obtained with the help of the COMSOL multiphysics software in the framework of a finite element method. Our findings indicate that on increasing Brownian motion and the chemical reaction rate, the fluid temperature becomes higher. An increase in the values of other physical parameters has the opposite effect. A variation in the boundary layer thickness typically results in changes in the concentration distribution in the flow. The angular velocity is deeply affected by the Eckert number, material parameter and magnetic number.
Nanofluid, magnetohydrodynamics, rotation, temperature, concentration
Cite This Article
Bhandari, A. (2019). Radiation and Chemical Reaction Effects on Nanofluid Flow Over a Stretching Sheet. FDMP-Fluid Dynamics & Materials Processing, 15(5), 557–582.