||CMES: Computer Modeling in Engineering & Sciences, Vol. 1, No. 1, pp. 91-98, 2000
||Full length paper in PDF format. Size = 171,250 bytes
||fracture mechanics, stress intensity factor, corner, electronic packaging
||In electronic devices, the corners of joined dissimilar
materials exist between plastic resin and a die pad or a chip.
Failure of the plastic resin is often caused from these corners
during the assembly process or the operation of products. The
strength evaluation of the corner is important to protect the
failure of plastic packages. To evaluate the singular stress field
around a corner, we utilize the stress intensity factors of the
asymptotic solution for a corner of joined dissimilar materials. We
show that the accurate stress intensity factor can be analyzed by
the displacement extrapolation method using the displacement
obtained from the finite element method, and the resulting stress
intensity factor can be utilized for the evaluation of the strength
of the corner in electronic devices.