Strength Evaluation of Electronic Plastic Packages Using Stress Intensity Factors of V-Notch
Toru Ikeda, Isao Arase, Yuya Ueno, Noriyuki Miyazaki

doi:10.3970/cmes.2000.001.091
Source CMES: Computer Modeling in Engineering & Sciences, Vol. 1, No. 1, pp. 91-98, 2000
Download Full length paper in PDF format. Size = 171,250 bytes
Keywords fracture mechanics, stress intensity factor, corner, electronic packaging
Abstract In electronic devices, the corners of joined dissimilar materials exist between plastic resin and a die pad or a chip. Failure of the plastic resin is often caused from these corners during the assembly process or the operation of products. The strength evaluation of the corner is important to protect the failure of plastic packages. To evaluate the singular stress field around a corner, we utilize the stress intensity factors of the asymptotic solution for a corner of joined dissimilar materials. We show that the accurate stress intensity factor can be analyzed by the displacement extrapolation method using the displacement obtained from the finite element method, and the resulting stress intensity factor can be utilized for the evaluation of the strength of the corner in electronic devices.
PDF download PDF