Open Access

ARTICLE

Wrinkling Analysis in a Film Bonded to a Compressible Compliant Substrate in Large Deformation

Zhicheng Ou¹, Xiaohu Yao¹, Xiaoqing Zhang^1,2, Xuejun Fan³

1 School of Civil Engineering and Transportation, South China University of Technology,Guangzhou 510640, PR China.
2 Corresponding author. E-mail: tcqzhang@scut.edu.cn
3 Department of Mechanical Engineering, Lamar University, Beaumont, TX, 77710, USA.

Computers, Materials & Continua 2014, 44(3), 205-222. https://doi.org/10.3970/cmc.2014.044.205

Abstract

The buckling of a thin film on a compressible compliant substrate in large deformation is studied. A finite-deformation theory is developed to model the film and the substrate under different original strain-free configurations. The neo-Hookean constitutive relation is applied to describe the substrate. Through the perturbation analysis, the analytical solution for this highly nonlinear system is obtained. The buckling wave number, amplitude and critical condition are obtained. Comparing with the traditional linear model, the buckling amplitude decreases. The wave number increases and relates to the prestrain. With the increment of Poisson’s ratio of the substrate, the buckling wave number increases, but the amplitude decreases. The displacements near the interface are different in two models.

---

Keywords

---