Vol.65, No.1, 2020, pp.945-962, doi:10.32604/cmc.2020.010089
OPEN ACCESS
ARTICLE
Research on Clothing Simulation Design Based on Three-Dimensional Image Analysis
  • Wenyao Zhu1, 2, Xue Li3, Young-Mi Shon4, *
1 College of Engineering, Lishui University, Lishui, 323000, China.
2 Department of Design, Graduate School, Chosun University, Gwangju, 61452, Korea.
3 Department of Materials Science and Engineering, Graduate School, Chosun University, Gwangju, 61452, Korea.
4 Design Division, College Art & Design, Chosun University, Gwangju, 61452, Korea.
* Corresponding Author: Young-Mi Shon. Email: nbzhn06@163.com.
Received 10 February 2020; Accepted 25 April 2020; Issue published 23 July 2020
Abstract
Traditional clothing design models based on adaptive meshes cannot reflect. To solve this problem, a clothing simulation design model based on 3D image analysis technology is established. The model uses feature extraction and description of image evaluation parameters, and establishes the mapping relationship between image features and simulation results by using the optimal parameter values, thereby obtaining a three-dimensional image simulation analysis environment. On the basis of this model, by obtaining the response results of clothing collision detection and the results of local adaptive processing of clothing meshes, the cutting form and actual cutting effect of clothing are determined to construct a design model. The simulation results show that compared with traditional clothing design models, clothing simulation design based on 3D image analysis technology has a better effect, with the definition of fabric folds increasing by 40%. More striking contrast between light and dark, the resolution increasing by 30%, and clothing details getting a more real manifestation.
Keywords
3D image, analysis clothing simulation, feature extraction, optimal solution, mapping relationship, collision detection, grid layout, cutting effect.
Cite This Article
Zhu, W., Li, X., Shon, Y. (2020). Research on Clothing Simulation Design Based on Three-Dimensional Image Analysis. CMC-Computers, Materials & Continua, 65(1), 945–962.
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